Apple's plan will make iPhone devices run faster with no risk to the user
Apple receives new patent for method that would allow iPhones to run faster without harming the user of the device
Apple receives patent for smart case that would allow iPhone to run at faster speeds without burning user's hand
Apple suggests that the magnets built into the interior of the case can help detect if an iPhone is wearing the accessory by creating a magnetic field that would be detected by sensors. NFC could also be used in conjunction with an RFID tag embedded inside the case allowing the iPhone to pick up a signal that would indicate the presence of a case on the phone. The patent mentions the possibility of creating different cases with different magnetic fields that could allow iPhone users to customize the handset to allow different maximum temperatures to be available.
With the system envisioned by the patent, Apple could also use the case to raise the temperature level which would cause the phone to automatically slow down the processing speed. This is because the case covers the aluminum case of the device, protecting users from burns. Thus, a user's iPhone could be allowed to run at a higher temperature before the throttle kicks in.
There is no idea when - or even if - Apple will use the system described in the patent. Apple has filed and receives a large number of patents each year, and not all of them make it into the hands of consumers.
Apple initially filed the patent application on February 28, 2019 after a similar application was filed on September 7, 2018. Apple itself explains what motivated the company to develop this system: “These electronic components (at the inside an iPhone) generate heat during operation. most of the heat is dissipated by convection and / or conduction. The air circulating around the surfaces of the appliance can dissipate heat by convection. Likewise, objects in contact with the device can dissipate heat by conduction. However, as the power of the device increases and the design of the device changes, sometimes the amount of heat generated cannot be dissipated adequately. In such cases, the temperature of the device will rise, which could lead to failure of the components themselves due, for example, to the melting of solder connections or defects in metal structures inside a integrated circuit. Even if the temperature does not rise to the point of causing breakdowns, the device f may be uncomfortable to handle. For example, the surfaces of the device can be hot to the touch, which can lead to an unpleasant user experience. Therefore, new techniques are desired for dissipating heat from the device or reducing an amount of heat generated by the device. “Think of this patent as one of the new techniques.